Teledyne DALSA is uniquely positioned to offer innovative custom solutions to exceed your next generation requirements. With a technology portfolio covering wavelengths from X-ray to infrared, Teledyne DALSA Custom Solutions delivers solutions tuned to your most challenging applications.
Teledyne DALSA's history in solid state imaging reaches back to 1969, when founder Dr. Savvas Chamberlain, one of the pioneers of CCD and CMOS image sensors, began his research. He founded the company to commercialize his work. Today Teledyne DALSA offers world-leading products in CMOS and CCDs with a wide range of advanced capabilities.
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Six-tile x-ray panel, 30 cm x 24 cm |
50 megapixel |
2 Gpix/sec backside thinned TDI |
100 million fps |
Radiation hard TDI |
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100 megapixel |
86 megapixel CMOS |
X-Ray TDI |
Board-level packaging |
70% QE, FSI |
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Multispectral TDI |
High-speed CMOS |
CMOS linescan |
Wafer-scale CCD |
Wafer-scale CMOS |
Teledyne DALSA is part of the Teledyne Imaging Group, and our sister companies offer related and complementary sensor capabilities:
Teledyne DALSA is uniquely positioned to offer innovative custom solutions to exceed your next generation requirements. With design and manufacturing expertise and engineering services spanning sensors, cameras, vision modules, specialized illumination, optics, data acquisition, and image processing, Teledyne DALSA Custom Solutions delivers vision solutions tuned to your most challenging applications.
Time to market is critical, and Teledyne DALSA has the tools in place to fast track challenging product developments. Customers will benefit from dedicated project teams focused on leading edge design, build, and manufacturing processes as well as a highly trained technical support team to assist with product test and integration.
From silicon to cameras, Teledyne DALSA's manufacturing capabilities include:
Electron detection TDI |
DUV TDI |
DUV linescan, 1MHz line rate |
High volume TDI for FPD inspection |
100 million fps, MIL-STD compliant |