Teledyne DALSA Inc
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Webinars

Join us for a webinar and discover the possibilities. These online, virtual events are a great way to connect with us and learn about our latest updates, see a demo, or participate in an interactive discussion with the community.

Upcoming Webinars

There are no upcoming webinars at this time. 

Past Webinars

Tuesday February 23rd 2021, 11:00 AM EST/9:00 AM MST
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MEMS: From Prototype Development to Mass Production

Whether you’re looking for a new or second fab for volume production, or are ready to transition to a production fab for the first time, you need a partner that will collaborate with you, develop a long standing relationship, and protect your intellectual property.

Teledyne DALSA and Teledyne Micralyne are pleased to announce the first in our 2021 series of webinars entitled MEMS: From Prototype to Mass Production will air live on February 23rd at 11:00AM EST. In this webinar, we will discuss important considerations when bringing your product to a MEMS fab and how to engage based on your stage of development and product lifecycle. We will share the necessary steps to develop and manufacture a high quality product with a repeatable process.

Speakers

Dean Spicer - Director of Engineering

Dean is Director of Engineering at Teledyne Micralyne in Edmonton, Alberta.  Dean joined Micralyne in 2006 as a Research and Development Engineer, specializing in Advanced Wafer Bonding processes (eutectic, fusion and anodic) and has excelled in a series of leadership roles before he was appointed to his current role. Dean is passionate about MEMS and works to bring customer’s products to market efficiently through the entire development cycle, from concept to finished product. Both detail-oriented and forward-thinking, Dean is a champion for process platforms that enable transfer of MEMS products to manufacturing through reduced development effort.
Jacques Renaud - Manager Process Integration

Jacques is the Manager of the Process Integration team at Teledyne DALSA MEMS foundry in Bromont and has Ph.D. in Physics from the University of Sherbrooke. After completing his Ph.D. in 2006, he joined Teledyne in the bonding and wafer level packaging process engineering team. Since then, he held multiple roles in process engineering, technology development, project management and process integration. During those years he played key roles in the process development and high volume production ramp of many highly successful MEMS programs for the consumer, industrial and automotive markets. He also managed the start-up of thin film, wafer bonding and polishing technologies at C2MI. Currently, as part of his role as Process Integration Manager, he leads the technical business development efforts for the Teledyne DALSA MEMS foundry.
Jayson Loewen - Senior NPI and Continuous Improvement Manager

Jayson is the Senior NPI and Continuous Improvement Manager at Teledyne Micralyne in Edmonton, Alberta. Jayson joined Micralyne in 2005 and has played key roles in product and process development, quality, and productivity. An authority in the MEMS development cycle, Jayson is focused on improving productivity, reducing product cycle time, and improving MEMS and microfabrication quality. Jayson is passionate about project management, Lean Six Sigma, Theory of Constraints, and quality improvement.
Tuesday November 17, 2020 - Thursday November 19, 2020
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Teledyne Imaging New Technology Showcase 2020

6 Industrial Imaging Technology Sessions, 1 Must Attend Virtual Event

While Covid-19 has forced the cancellation of tradeshows and conferences around the world, our product development team hasn’t slowed at all. Over the last six months, we’ve introduced dozens of new imaging components, driving significant advances in key industrial vision segments; including machine learning and AI; extreme high-resolution and high-speed imaging; 3D sensing; multi-spectral imaging; and high-volume, low-cost CMOS sensors. Please join us for this multi-session, virtual event to learn about the newest and most innovative imaging solutions from Teledyne.

Tuesday June 30, 2020 09:00 AM EST
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Introduction to Linea SWIR line scan

Teledyne’s new SWIR line scan camera enables defect detection beyond the visible.

We're excited to share with you the capabilities of our latest line scan camera - the Linea SWIR - a GigE line scan camera that allows you to detect the non-visible. We'll cover who we are, what SWIR is; and an introduction to the Linea SWIR, its features, and applications; as well as what it means to be powered by DALSA. Hope you can join us!

Speakers

Mike Grodzki - Product Manager
Mike began his career at Teledyne DALSA as a Research Analyst, and since 2018, has served as Product Manager for the company’s Linea SWIR series, and the soon-to-be-released Linea2 line scan cameras. Mike is a passionate product professional and thrives on building relationships with customers to understand their pain points and drive a product strategy that resonates with the market.

 

Matthias Sonder - Development Lead
Matthias is an experienced and skilled team lead for Teledyne DALSA’s Product Development, Research and Development (R&D) efforts, with expertise in Semiconductors, Physics, and Engineering. Matthias holds a Master's Degree in Physics from University of Ulm, Germany.

Christian Loeb - Key Account Manager
Christian Loeb is a Key Account Manager for Teledyne DALSA Europe. With solid technical expertise, deep experience in machine vision, and long term relationships, he delivers both understanding and capability to our OEM customers.