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Teledyne’s Dany Longval to speak on the potential of AI for vision solutions at CRAV.ai conference

Ottawa, Canada – October 29, 2019Teledyne Lumenera and Teledyne DALSA, both part of the Teledyne Imaging group, are pleased to announce their combined presence at the Collaborative Robots, Advanced Vision & A.I. Conference (CRAV.ai) in San Jose, CA, November 12-13, 2019.

On display at tabletop #35 you will find popular GigE Vision and USB cameras from Teledyne DALSA and Lumenera that are ideally suited to aerial imaging, intelligent traffic systems, life sciences, photonics, and other embedded vision and general machine vision applications. Both companies will showcase their new and advanced vision and sensor solutions for AI.

In a presentation titled Real World Challenges for AI in Vision Applications, Dany Longval, Vice President Worldwide Sales for Teledyne Lumenera, will address how advancements in artificial intelligence, particularly in deep learning, have accelerated the proliferation of vision-based applications. The focus of this presentation will be on lessons learned in trying to harness the potential of AI from the point of view of a developer and integrator of vision solutions. Catch the presentation at 2 pm on November 13.

Where:                
CRAV.ai
Tabletop #35
Doubletree by Hilton San Jose
San Jose, California

When:                 
November 12-13

Media Note:    Teledyne Imaging management will be available for media interviews during the show. For interview requests, please email [email protected]

Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne Technologies [TDY] umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage. For more information, visit www.teledyneimaging.com

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All trademarks are registered by their respective companies.
Teledyne DALSA reserves the right to make changes at any time without notice.

Media Contact:
Brooks Riendeau
Vice President of Marketing
(t) 1.613.736.4077 x 120
[email protected]

Published 2019-10-29



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