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Teledyne DALSA’s Young Song to present at IPC APEX EXPO

Waterloo, Ontario– January 28, 2019 – Teledyne DALSA Process Engineering Specialist, Young Song, will be presenting a joint white paper at the IPC APEX conference in San Diego, California this week. The white paper, Approaches to Overcome Nodules and Scratches on Wire Bondable Plating on PCBs, was written by Young Song and Vanja Bukva of Teledyne DALSA, and Ryan Wong of FTG Circuits.

Mr. Song will be presenting as a part of the Technical Conference Session on January 30th and explaining different approaches to overcome nodules and scratches on wire bondable plating on PCBs. He will encourage listeners to reconsider the acceptability criteria of nodules and other abnormalities on PCB wire bond pads, which have become increasingly restrictive as wire bond pad sizes shrink.

IPC APEX EXPO is a five-day event held annually in San Diego, California which offers endless education and networking opportunities. Each year, professionals from the printed circuit board and manufacturing industry come together to participate in the Technical Conference, Exhibition, Professional Development, and Certification programs.

About Teledyne Digital Imaging, Inc.
Teledyne Digital Imaging, a Teledyne Technologies company, is an international leader in high performance digital imaging and semiconductors with approximately 1,000 employees worldwide, headquartered in Waterloo, Ontario, Canada. Established in 1980, the company designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing specialized semiconductor products and services including MEMS. For more information, visit Teledyne Imaging’s website at www.teledyneimaging.com.

Published 2019-01-28

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