Trenton, New Jersey, USA, April 20, 2023 – Teledyne will showcase their latest products and solutions at SPIE’s Defense and Commercial Sensing exhibition taking place May 2-4, in Orlando, Florida. Visitors to booth #1003 can expect to find representatives from Teledyne FLIR’s OEM, Optics and R&D Solutions groups, and Teledyne’s DALSA, e2v, Judson, and Princeton Instruments businesses.

Products and demonstrations on the booth include:

• Teledyne DALSA will showcase its ISR solutions – including one and two dimensional visible, SWIR, and MWIR multispectral TDI/hyperspectral arrays
• Teledyne FLIR Research & Development Solutions will present new features of its version 3.0 – Research Studio Professional Edition v.3.0, including improved user calibrations, measurements functions, and emissivity calculator
• Teledyne FLIR’s OEM business will be demonstrating the recently expanded radiometric Boson+ LWIR camera module line  
• Teledyne Princeton Instruments will feature COSMOS® large format, deep-cooled, CMOS cameras.
• Teledyne e2v will be featuring their CHROMA-D UV-SWIR Sensors, the CIS120, and Multispectral qTDI CMOS CIS125 Sensor
• Teledyne Judson Technologies will feature infrared detectors for defense, military, space, and commercial applications.

In addition, the following presentations and papers are planned:

May 1, 2023, 12:00 – 4:30 PM EDT | Ballroom Level, Osceola A

• Understanding the 5 S’s of IR detector selection, Jeff Koon, FLIR R&D Solutions

• MicroCalibir: a core module optimized for multipurpose applications, Jean Brunelle, Teledyne DALSA

May 3, 2023, 1:00 - 2:45 PM EDT | Exhibition Hall, Industry Stage

• Hyperspectral imaging in the infrared, Paul Mark, Teledyne Judson Technologies
• Computational Imaging in Defense Electro Optical Systems, Arthur Stout, Teledyne FLIR

May 4, 2023, 8:50 - 9:10 PM EDT | Exhibition Hall, Osceola Ballroom B

• Uncooled IR open customizable platform designed for multipurpose applications, Jean Brunelle, Teledyne DALSA

Teledyne is a global powerhouse of advanced technology companies aligned under the Teledyne umbrella. These companies form an unrivalled collective of expertise across the spectrum with decades of experience and best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest sensing and related technology portfolio in the world. From aerospace through industrial inspection, scientific research, spectroscopy, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne offers worldwide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.

For media enquiries, please contact:

Debby Flint-Baum
debby.flint-baum@teledyne.com