WATERLOO, Ontario - June 14, 2011 - Teledyne DALSA will present at the Nanotech Conference & Expo 2011 in Boston, MA on June 15, 2011 regarding the progress of the MiQro Innovation Collaborative Center (C2MI) as it enters its final phase of construction.
The presentation will highlight the features of the center and its research labs, as well as identify who will be eligible to join the innovation center. Christian Veilleux, Project Manager, will discuss the MEMS industry challenges that Teledyne DALSA will address through research at the center, located in Bromont Quebec.
"Teledyne DALSA has taken a leadership role in the specification, installation and ongoing operational responsibility for the MEMS and Wafer Level Packaging (WLP) related equipment of the center," Veilleux noted. "I am very pleased with the collaboration of our partners as we work to complete construction."
The purpose of the center, supported by the Government of Canada, the Quebec Government and additional partners, is to create a global center of excellence for commercialization and research in 200 mm-based microelectromechanical systems (MEMS) and 3D WLP as well as advanced technologies associated with the assembly and packaging of silicon chips.
Teledyne DALSA is a proud founding partner in the innovation center along with the initial founding partners and various semiconductor equipment suppliers. Others may join at a later date and will provide financial and in-kind support to the project for ongoing operations.
Where: Nanotech Conference & Expo 2011
Room 206, Hynes Convention Center, Boston, MA
Presentation: "MEMS Challenges undertaken by Teledyne DALSA at C2MI"
When: Wednesday, June 15, 2011
11:15 AM EST
About Teledyne DALSA Semiconductor
Located in Bromont, Quebec, Canada, Teledyne DALSA's award winning semiconductor wafer foundry has a proud history of innovation in specialties such as MEMS, CCDs, and high voltage CMOS. As a pure-play foundry, our goal is to deliver innovative foundry capabilities as a manufacturing partner to fabless and fab-lite semiconductor companies to help them succeed with their advanced MEMS or IC designs. Visit www.teledynedalsa.com/semi for more information.
About Teledyne DALSA, Inc.
Teledyne DALSA, a Teledyne Technologies company, is an international leader in high performance digital imaging and semiconductors with approximately 1,000 employees worldwide, headquartered in Waterloo, Ontario, Canada. Established in 1980, the company designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing MEMS products and services. For more information, visit Teledyne DALSA's website at www.teledynedalsa.com.
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Teledyne DALSA reserves the right to make changes at anytime without notice.
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The MiQro Innovation Collaborative Center in Bromont Quebec will be a global center of excellence for commercialization and research in MEMS and silicon chip packaging.