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PRESS RELEASE: Teledyne DALSA Semiconductor to Feature New MIDIS Platform at MEMS China

WATERLOO, Ontario June 21, 2013 - Teledyne DALSA Semiconductor, a Teledyne Technologies company, will feature its new MIDIS™ platform in addition to its latest advancements in design and fabrication at MEMS China held June 25-27, 2013 at the Shanghai Everbright Convention and Exhibition Center in Shanghai, China. Teledyne DALSA will exhibit at booth 260.

On June 25, time TBC, Teledyne DALSA will present, “MIDIS Platform: MEMS Integrated Design for Inertial Sensors,” in the Forum Room and demonstrate its design and manufacturing capabilities and comprehensive technology portfolio that provides pure-play foundry services to customers worldwide.

At MEMS China Teledyne DALSA will exhibit:

New MIDIS Platform – As a MEMS fabrication platform for motion sensing devices, the MIDIS platform is designed to provide high volume, low cost manufacture of accelerometers and gyroscopes or the integration of both into an Inertial Measurement Unit (IMU), addressing the rapidly expanding demand for inertial sensors for consumer (mobile), automotive, and sports/health applications. Register for the live webcast, which will take place on June 27, 2013.

Leading Independent Pure-Play MEMS Foundry on 150mm & 200mm Wafers -Teledyne DALSA has extensive experience with advanced fabrication strategies and a profound understanding of the physics and materials science that make rapid new product introductions of MEMS and MOEMS possible. Teledyne DALSA MEMS/MOEMS proven process module portfolio on 150mm and 200mm wafers is recognized as exceptional and represents true competitive advantage for manufacturing of MEMS micro-mirrors and other optical MEMS applications.

High Voltage Electrostatic Actuator Design & Manufacturing - Teledyne DALSA also offers a full suite of product development and manufacturing solutions for low-power, high-channel count actuators for compact, high density systems. Teledyne DALSA will exhibit the DH9685AB which extends Teledyne DALSA's industry leading MEMS and MOEMS capability and provides a cost-effective solution for high density systems. It has 96 High Precision, High Voltage Channels up to 240V in a 17x17 mm BGA Package, ROHS compliant. It operates through a versatile digital 3-wire interface.

Customer Interaction / Business Partnerships - Teledyne DALSA's technology portfolio, together with excellence in planning, quality assurance, and customer interaction deliver highly productive relationships with both customers and business partners.

Media Note: For interview requests, please email [email protected] or visit booth 260. Teledyne DALSA management will be available for media interviews during the week of the show. For high resolution images of Teledyne DALSA products, please visit our online media kit.

About Teledyne DALSA Semiconductor
Located in Bromont, Quebec, Canada, Teledyne DALSA's award winning semiconductor wafer foundry has a proud history of innovation in specialties such as MEMS, CCDs, and high voltage CMOS. As a pure-play foundry, our goal is to deliver innovative foundry capabilities as a manufacturing partner to fabless and fab-lite semiconductor companies to help them succeed with their advanced MEMS or IC designs. For more information, visit www.teledynedalsa.com/semi

About Teledyne DALSA, Inc.
Teledyne DALSA, a Teledyne Technologies company, is an international leader in high performance digital imaging and semiconductors with approximately 1,000 employees worldwide, headquartered in Waterloo, Ontario, Canada. Established in 1980, the company designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing specialized semiconductor products and services including MEMS. For more information, visit Teledyne DALSA’s website at www.teledynedalsa.com.

All trademarks are registered by their respective companies.
Teledyne DALSA reserves the right to make changes at any time without notice.

Media Contact:
Heather Neale
Teledyne DALSA
Tel: +1-514-333-1301 ext. 4227
Email: [email protected]

Sales Contact:
[email protected]

Published 2013-06-21

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