Waterloo, CANADA ─ November 10, 2020 ─ Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company and global leader in machine vision, is pleased to announce its new Genie Nano-CXP 67M and 37M cameras based on the Teledyne e2v Emerald color and monochrome sensors.
The newest Genie Nano models are easy-to-use and feature a CoaXPress interface. The cameras are engineered for industrial imaging applications requiring high-speed data transfer, such as industrial automation, electronics manufacturing, packaging inspection, semiconductor inspection, PCB-AOI (Automated Optical Inspection), and general machine vision. Designed for a wider range of operating temperatures (from -20°C to 60°C housing temperature), the cameras can be integrated in harsh environments in imaging systems and increases their long-term reliability.
“With the addition of these higher resolution Genie Nano models, our camera portfolio spans resolutions from 16M to 67M with a CoaXPress 6Gbps interface to deliver the maximum throughput from leading-edge, high-resolution CMOS image sensors,” said Manny Romero, Senior Product Manager at Teledyne DALSA.
The Genie Nano-CXP 67M and 37M cameras are fully integrated with Teledyne DALSA’s Xtium™-CXP and Xtium2™-CXP series high performance frame grabbers, providing both convenience and guaranteed compatibility from a single vendor. The Xtium series frame grabbers are also supported by Sapera LT SDK, an image acquisition and control software development toolkit (SDK) that includes Trigger-to-Image (T2IR) framework for maximum reliability of the image acquisition system.
For more information about the Genie Nano-CXP 67M and 37M camera models visit the website. For high quality images, please visit our online media kit.
Teledyne DALSA is part of the Teledyne Imaging group and a world leader in the design, manufacture and deployment of digital imaging components for the machine vision market. Teledyne DALSA image sensors, cameras, smart cameras, frame grabbers, software, and vision solutions are used in thousands of automated inspection systems around the world and across multiple industries including semiconductor, solar cell, flat panel display, electronics, automotive, medical, packaging and general manufacturing. For more information, visit www.teledynedalsa.com/mv.
Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, scientific research, spectroscopy, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers worldwide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.
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Teledyne DALSA reserves the right to make changes at any time without notice.
Brooks Riendeau, Vice President of Marketing
613-736-4077 ext. 120
Teledyne DALSA expands its Genie Nano camera portfolio with CXP models built around Teledyne e2v Emerald CMOS sensors