Waterloo, CANADA, March 17, 2020 ─ Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company and global leader in machine vision technology, is pleased to announce its new Genie^TM Nano-CXP C4090 and C5100 cameras, based on the On-Semi^TM 16M and 25M Mono color sensors, are in full production now.

Built around the industry’s leading CMOS image sensors, these latest models range from 16 to 67-megapixel resolution with proven CoaXPress^TM 6.25 Gbps technology offering breakthrough speed, robust build quality for wide operating temperatures, and an unmatched feature set. Perfectly complemented by the half-length Xtium-CXP^TM frame grabber, they have been designed to work synergistically, minimizing CPU usage and improving processing times for host applications by enabling maximum sustained throughput and ready-to-use image data. The Genie Nano-CXP cameras are a perfect upgrade to significantly slower Camera Link^TM based systems.

Offering 25 million pixels at 80 fps in a small form factor, Genie Nano-CXP cameras are engineered to deliver high-speed, dependable results for applications such as semiconductor wafer inspection, electronics manufacturing, solar panel inspection, and general machine vision.

Key Features:

• Six models are offered, in 16M and 25M in monochrome, color and NIR enhanced versions
• Industry’s smallest 25M CXP cameras
• Trigger-to-Image Reliability (T2IR) framework improves the reliability of your inspection system and protects from data loss
• GenICam, CoaXPress 1.1 compliant
• Robust all-metal body with 3-year warranty

For more information about the Genie Nano-CXP models visit the website. For high quality images, please visit our online media kit.

Teledyne DALSA is part of the Teledyne Imaging group and a world leader in the design, manufacture and deployment of digital imaging components for the machine vision market. Teledyne DALSA image sensors, cameras, smart cameras, frame grabbers, software, and vision solutions are used in thousands of automated inspection systems around the world and across multiple industries including semiconductor, solar cell, flat panel display, electronics, automotive, medical, packaging and general manufacturing. For more information, visit www.teledynedalsa.com/mv.

Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.

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Media Contact:
Geralyn Miller
Global Media Relations
519-886-6000 ext. 2187                                                                                                
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