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DALSA to Showcase Advances in MEMS Fabrication at Electronica 2010

WATERLOO, ONTARIO – November 9, 2010 – DALSA Corporation [TSX: DSA], a world-leading semiconductor and MEMS foundry, will feature its latest advancements in MEMS fabrication along with its innovative HV ASIC design capabilities at Electronica 2010 in Munich, November 9 – 12, 2010, Hall A2, Booth 418. Electronica is the world’s leading trade fair for electronic components, systems and applications.

DALSA’s Design and Foundry Showcase at Electronica:

#1 Independent Pure-Play MEMS Foundry in the World - DALSA has been ranked as the world’s leading independent pure-play MEMS foundry by Yole Développement, a market research firm specializing in MEMS. DALSA joins Yole’s Annual Top 30 MEMS Company ranking for the first time, bolstered by a 19% year-over-year US dollar increase in MEMS revenue in 2009, the third highest growth rate among all MEMS suppliers.

MEMS Foundry - DALSA is renowned for its extensive experience with advanced fabrication strategies such as stacking circuits to reduce package size or combining MEMS and CMOS wafers to integrate sense and actuation with logic circuits. DALSA delivers field-proven 3D and wafer level packaging technologies including through-silicon vias and a wide range of wafer bonding techniques on both 150 and 200mm wafer diameter.

HV ASIC Design - DALSA’s years of expertise in the design of application specific MEMS driver chip with a system-level perspective and specialized Engineering Design Assistance (EDA) tools turns customer requirements into a custom, purpose-built solution with optimal, differentiating performance for true competitive advantage.

Customer Interaction / Business Partnerships – DALSA’s technology portfolio, together with excellence in planning, quality assurance, and customer interaction deliver highly productive relationships with both customers and business partners. Only through the dedication of DALSA’s engineers, technicians, and operators to exceptional project management, comprehensive resource planning, rigorous quality methodologies, and devoted customer communication has the company achieved its global reputation for success.

DALSA is looking for partners and users for its new ''Micro Innovation and Collaborative Center,” a research and development center focused on advanced packaging technology development. Interested parties should visit DALSA at Booth 418 or contact [email protected].

Where: Electronica
              New Munich Trade Fair
              Munich, Germany
              Hall A2, Booth 418
When: November 9 – 12, 2010

About DALSA Semiconductor
Located in Bromont, Quebec, Canada, DALSA's award winning semiconductor wafer foundry has a proud history of innovation in specialties such as MEMS, CCDs, and high voltage CMOS. As a pure-play foundry, our goal is to deliver innovative foundry capabilities as a manufacturing partner to fabless and fab-lite semiconductor companies to help them succeed with their advanced MEMS or IC designs. Visit www.dalsa.com/semi/ 

About DALSA Corporation
DALSA (TSX: DSA) is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees worldwide, headquartered in Waterloo, Ontario, Canada. Established in 1980, the company designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing semiconductor products and services. For more information, visit www.dalsa.com 

Media Contact:

Maria Doyle
Red Javelin Communications, Inc.
Tel: +1-781-964-3536
e-mail: [email protected]

Published 2010-11-09

DALSA has been ranked as the world’s leading independent pure-play MEMS foundry by Yole Développement, a market research firm specializing in MEMS.

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