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Foundry

Processes and Technologies

Teledyne DALSA offers customers a truly unmatched toolbox of dozens of proven and patented process modules and techniques in both 150 and 200 mm lines. We are proud of our toolbox, but even more proud of our mastery of it. The greatest value Teledyne DALSA offers you is our ability to leverage and integrate individual foundry processes to bring your breakthrough MEMS designs into production.

Teledyne DALSA's 200 mm MEMS line has been installed to provide capacity for higher volume production, and to support wafer level bonding of MEMS to 200 mm CMOS wafers. There is a high degree of commonality between our 150 mm and 200 mm MEMS lines, and most applications which run on 150 mm can be transferred to 200 mm if required.

Lithography

  • 5X front to front  (ASML)  0.35 µm feature, 0.1 µm accuracy
  • 5X front to back (ASML)   0.35 µm feature, 0.2 µm accuracy
  • 1x front to front 3.0 µm feature, 0.5 µm accuracy
  • 1x front to back  3.0 µm feature, 0.75 µm accuracy

Positive & negative resists

  • Dry film lamination of photo-definable thick polymers 
  • Spin coating of thin and thick photoresists and photopolymers

Plasma Deposition

  • PECVD TEOS, nitride. 

Dicing

  • Automated taping/dicing
  • UV backing and cover tapes.

Ion Implantation

  • Low Current , High Current
  • Species: B, BF2, P, As. Energy : 30 keV to 200 keV

Wafer Bonding

Si-Si, Si-SiO2, glass frit, anodic, Al-Ge eutectic, polymer

Wafer Thinning

Backgrind, CMP, edge grind

Metallization

  • Sputter Al, AlCu, AlSiCu, Ti, TiN, Ge, SiCr
  • CVD Tungsten
  • Electroless Plating Ni/Pd, Ni/Au

Metrology (in-line)

  • ACV4, CD-SEM, ellipsometer, interferometer
  • Spectroscopic reflectometer, surfscan
  • August NSX

Furnaces : Horizontal, Vertical

  • Wet/dry oxidation
  • POCL doping
  • Nitride (including low stress)
  • LPCVD oxide (LTO, SG/PSG, TEOS)
  • LPCVD silicon (poly, amorphous, in-situ doped)
  • SAM coating

Test

  • Keithley Parametric testers
  • MEMs electrical, optical and acoustic testing
  • Test development service for MEMs
  • Customer specific test systems