Teledyne DALSA offers customers a truly unmatched toolbox of dozens of proven and patented process modules and techniques in both 150 and 200 mm lines. We are proud of our toolbox, but even more proud of our mastery of it. The greatest value Teledyne DALSA offers you is our ability to leverage and integrate individual foundry processes to bring your breakthrough MEMS designs into production.
Teledyne DALSA's 200 mm MEMS line has been installed to provide capacity for higher volume production, and to support wafer level bonding of MEMS to 200 mm CMOS wafers. There is a high degree of commonality between our 150 mm and 200 mm MEMS lines, and most applications which run on 150 mm can be transferred to 200 mm if required.
Si-Si, Si-SiO2, glass frit, anodic, Al-Ge eutectic, polymer
Backgrind, CMP, edge grind