Imaging

Components & Systems

Cameras
High performance 1D/2D CMOS and CCD cameras.
3D Sensors
High accuracy laser profiling, stereo imaging, and Time-of-Flight sensors and cameras.
Frame Grabbers
Industry-leading image acquisition boards.
Image Sensors
Sensing all the wavelengths since 1980.
Software
From user friendly application software to industrial strength code libraries and SDKs.
Smart Cameras / Vision Sensors
Compact, self-contained vision tools with embedded software.
Vision Systems - Multicamera
Scalable multi-camera systems with embedded software.
Embedded Vision Systems
Scalable multi-camera systems with embedded software.
Medical & Dental X-Ray
Industry-leading low dose CMOS detectors and image processing software for medical and dental applications including fluoroscopy.
Industrial X-Ray
Powerful, innovative detectors and X-Ray generators for NDT and security applications.
Infrared Detectors
Versatile uncooled long-wave infrared sensors for industrial and defense applications.
Custom Design
Made-to-order solutions, from minor tweaks to major engineering.
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MEMS & Semiconductors

Specialized Semiconductor Services

MEMS Fabrication
One of the world's foremost pure-play MEMS foundries, supporting both 150 mm and 200 mm wafer processes.
CCD Fabrication
Industry-leading manufacturing capability for high-performance CCD fabrication processes.
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Foundry

Processes and Technologies

Teledyne DALSA, together with sister foundry Teledyne Micralyne, offers customers a truly unmatched toolbox of dozens of proven and patented process modules and techniques in both 150 and 200 mm lines. We are proud of our toolbox, but even more proud of our mastery of it. The greatest value we offer you is our ability to leverage and integrate individual foundry processes to bring your breakthrough MEMS designs into production.

Teledyne DALSA's 200 mm MEMS line has been installed to provide capacity for higher volume production, and to support wafer level bonding of MEMS to 200 mm CMOS wafers. There is a high degree of commonality between our 150 mm and 200 mm MEMS lines, and most applications which run on 150 mm can be transferred to 200 mm if required.

Lithography

5X front to front (ASML) 0.35 µm feature, 0.1 µm accuracy
5X front to back (ASML) 0.35 µm feature, 0.2 µm accuracy
1x front to front 3.0 µm feature, 0.5 µm accuracy
1x front to back 3.0 µm feature, 0.75 µm accuracy

Positive & negative resists

Dry film lamination of photo-definable thick polymers
Spin coating of thin and thick photoresists and photopolymers

Plasma Deposition

PECVD TEOS, nitride.

Dicing

Automated taping/dicing
UV backing and cover tapes.

Ion Implantation

Low Current , High Current
Species: B, BF₂, P, As. Energy : 30 keV to 200 keV

Wafer Bonding

Si-Si, Si-SiO₂, glass frit, anodic, Al-Ge eutectic, polymer

Wafer Thinning

Backgrind, CMP, edge grind

Metallization

Sputter Al, AlCu, AlSiCu, Ti, TiN, Ge, SiCr
CVD Tungsten
Electroless Plating Ni/Pd, Ni/Au

Metrology (in-line)

ACV4, CD-SEM, ellipsometer, interferometer
Spectroscopic reflectometer, surfscan
August NSX

Furnaces : Horizontal, Vertical

Wet/dry oxidation
POCL doping
Nitride (including low stress)
LPCVD oxide (LTO, SG/PSG, TEOS)
LPCVD silicon (poly, amorphous, in-situ doped)
SAM coating

Test

Keithley Parametric testers
MEMs electrical, optical and acoustic testing
Test development service for MEMs
Customer specific test systems

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