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Teledyne DALSA extends its Xtium2 frame grabber series with low-cost, feature-rich CLHS model

WATERLOO, Canada – October 29, 2019 - Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company and global leader in machine vision technology, is pleased to announce its Xtium2-CLHS PX8 LC ─ the latest member of the Xtium2-CLHS PX8 series for the PCIe Gen3 platform.

The Xtium2-CLHS supports Active Optical Cable (AOC) and industry standard CX4 cables. This single cable, single slot solution supports up to 4-CLHS lanes, each operating at 10-Gb/s, to acquire images at 5.0GB/s and transfer them using PCIe x8 slots at a sustained speed above 6.8GB/s to the host memory. 

Teledyne DALSA’s Xtium2-CLHS family features sophisticated, high-efficiency data transmission technology to deliver higher image throughput, longer cable distances (beyond 100 meters) and built-in support for real-time distributed image processing capabilities. The Xtium2-CLHS family reduces both system complexity and cost while maintaining flexibility.

 “The Xtium2-CLHS PX8 LC offers a well-balanced set of features critically required for high-speed, error-free, cost-sensitive and real-time imaging applications,” said Senior Product Manager, Inder Kohli.

When combined with cutting-edge color, and multispectral line scan cameras like the new Linea ML, Xtium2-CLHS PX8 LC frame grabbers enable the newest and most demanding vision applications.  

Xtium2-CLHS PX8 LC Key Features:

  • Supports Active Optical Cables (AOC) for longer cable distance at max data rate
  • Data forwarding at maximum input data rate for distributed image processing
  • Synchronized acquisition from multiple independent cameras
  • Ready to use pixel formats reduce processing time
  • High reliability with advanced metadata
  • Fully supported by Sapera Vision Software SDKs

Please visit the Xtium2-CLHS PX8 LC product page for more information. For sales enquiries, visit our contact page, and for full resolution images, our online media kit.

About Teledyne DALSA
Teledyne DALSA is an international technology leader in sensing, imaging, and specialized semiconductor fabrication. Our image sensing solutions span the spectrum from infrared through visible to X-ray; our MEMS foundry has earned a world-leading reputation. In addition, through our subsidiaries Teledyne Optech and Teledyne CARIS, we deliver advanced 3D survey and geospatial information systems. Teledyne DALSA employs approximately 1400 employees worldwide and is headquartered in Waterloo, Canada. For more information, visit www.teledynedalsa.com.

About Teledyne Imaging

Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne Technologies [TDY] umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage. For more information, visit www.teledyneimaging.com

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All trademarks are registered by their respective companies.
Teledyne DALSA reserves the right to make changes at any time without notice.

Media Contact: 
Geralyn Miller
Senior Manager, Global Media Relations 
Tel: +1-519-886-6001 ext. 2187
Email: geralyn.miller@teledyne.com

Sales Contacts:
Sales.americas@teledynedalsa.com
Sales.europe@teledynedalsa.com
Sales.asia@teledynedalsa.com

Published 2019-10-29