Teledyne DALSA Semiconductor, in conjunction with CMC Microsystems, operates a "shuttle run," providing regularly scheduled fabrication of multi-project wafers. With this service, designers can "share" wafer runs, conducting low-volume experiments with different designs on a portion of a wafer without the cost of a full wafer run.
Delivery quantity is thirty (30) unpackaged dice.
|0.8 µm CMOS||MEMS Platform|
Service is available for all 0.8 µm processes:
CMOS process shuttle runs are processed with three layer metal and high value polysilicon resistors.
Service is available for our MIDIS MEMS platform
Success Story: NEXSENS
MEMS sensors and timing devices developed by emerging Montreal company, NXTSENS Microsystems are setting industry-leading performance records.
“By taking advantage of the MIDIS platform, we have created one of the world’s best MEMS absolute pressure sensors,” he says. “Our absolute capacitive pressure sensor has the most accurate and stable vacuum reference and can be optimized to various industrial applications by simply fine-tuning the sensing membrane....Because the process is already optimized, it has drastically shortened our development time.”
--Vamsy Chodavarapu, Vice President-Research, NXTSENS
Teledyne DALSA Semiconductor MPW service manages many designs on different processes. To assure reliability, feasibility, and short processing time for your design, Teledyne DALSA Semiconductor stated some requirements your design must fulfill. Please refer to the following document for details and contact CMC for Guidance.