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Company Profile

Teledyne DALSA is one of the world’s foremost pure-play foundries for MEMS, high voltage CMOS, and advanced CCDs. What sets us apart? Without a doubt it is our vast and unique wafer fabrication repertoire, the mastery of which we have earned through decades of research, innovation, and process development. This unparalleled technology portfolio enables us to bring our customers’ breakthrough designs from conception to reality in high volume production for true competitive advantage.

From design support to full custom HV ASIC design services, Teledyne DALSA puts its experience at your command. Our rare ability to optimize architecture, performance, and reliability serves high-volume, mission-critical microsystems in photonics, telecom, biomedical, industrial, and consumer applications for fabless semiconductor players and integrated device manufacturers.

Teledyne DALSA’s demonstrated ability to transfer and customize MEMS and analog/mixed signal CMOS processes is unsurpassed in the industry, and with our high standards for quality and customer service, we offer a commitment to success that is matched only by your own.

Customers and Confidentiality

Teledyne DALSA Semiconductor is an "open foundry", supplying specialized wafers and devices fabrication to a wide range of fabless and IDM organizations for more than 25 years. With such a range of clients, customer information and data confidentialty is paramount. Teledyne DALSA Semiconductor is proud of its foundry's reputation in assuring customer confidentiality.

About Teledyne DALSA 

Teledyne DALSA, a subsidiary of Teledyne Technologies Inc., is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees world-wide. Established in 1980, the Company designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. Teledyne DALSA's core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.
 

"Our remarkable technology portfolio, deep experience, and commitment to customer service enables us to bring our customers’ breakthrough MEMS designs from conception to reality in high volume production for true competitive advantage."

Brian Doody
Teledyne DALSA Chief Executive Officer

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