Semiconductor » Fab » Production

Manufacturing & Production

Teledyne DALSA has supplied specialized wafers and device fabrication to a wide range of fabless and IDM organizations for more than 25 years. We operate over 41000 square feet / 3800 m2 of clean rooms 24/7and deliver over 100000 wafers per year. We manufacture CCDs and HV-CMOS on 150 mm wafers, and MEMs on both 150 mm and 200 mm.

With a technology portfolio as wide and flexible as ours, with deliverables as varied as ours, excellence in planning, quality assurance, and customer interaction are not optional activities—they are fundamental business requirements. Only through the dedication of our engineers, technicians, and operators to exceptional project management, comprehensive resource planning, rigorous quality methodologies, and devoted customer communication have we achieved our global reputation for success.

Similarly, with our wide range of clients, dedication to confidentiality is paramount. Teledyne DALSA Semiconductor is proud of its reputation in assuring customer confidentiality and protecting customer intellectual property.

Production control

One of the keys to our award-winning foundry is our outstanding production control.

  • Process flows are 100% integrated in Promis (Process Management Integration System), allowing paperless manufacturing and 100% traceability.
  • Line balancing is done through a KANBAN system
  • Real time shop floor dispatching system (ORDOJAT software based on Promis) is used at all stages of the process. This system allows a very tight control over On Time Delivery, one of the reasons we received Motorola foundry of the year award for 2001 and Gold Performance Awards in 2000 and 2001.
  • Very flexible production line allowing simultaneous fabrication of hundreds of different products and processes. Priority levels can be used to expedite rush orders.
  • SPC monitoring is 100% integrated on Promis and is used at all critical steps.
  • Automatic recipe download is used at many steps in the process (Furnace, Ion implanters, Acid bath controller, Plasma etcher, PECVD, Steppers) to reduce operation errors and increase line yield.
 

 

 

 

 

 

Product Engineering Support

Our product engineering support includes these services:

  • Microanalytical Services for NPI
  • Product Characterization
  • Product Reliability Qualification
  • Characterization and Production Test Program Development for HV ASIC and MEMS
  • Test Program Transfers

 

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