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Custom Sensor Capabilities

Custom Solutions

Leading Edge Image Sensor Technologies

Teledyne DALSA's history in solid state imaging reaches back to 1969, when founder Dr. Savvas Chamberlain, one of the pioneers of CCD and CMOS image sensors, began his research. He founded the company to commercialize his work. Today Teledyne DALSA offers world-leading products in CMOS and CCDs with a wide range of advanced capabilities.

Capabilities include:

CMOS and CCD design
NIR and IR sensors, including Microbolometers
Color and multispectral filters
Spectrum coverage from X-ray through deep UV, visible, NIR, SWIR, MWIR, and LWIR
Backside thinning
Radiation tolerance
Ultra high speed (100 Mpfs)
Ultra high resolution (100+ megapixels)

Wafer scale devices
Custom window attachment and sensor packaging for challenging environments
Fiber optic attachments
Extended environmental testing, including basic MIL-STD
Backside Thinning for high sensitivity and QE
Radiation Hardness
Multispectral Filters

Spectrum Coverage

Select a spectrum area to learn more about it and our related capabilities:

X-Ray Ultraviolet Visible Light Near Infrared Short-Wave Infrared Medium-Wave Infrared Long-Wave Infrared

Example Completed Designs

Six-tile x-ray panel, 30 cm x 24 cm	50 megapixel	2 Gpix/sec backside thinned TDI	100 million fps	Radiation hard TDI
100 megapixel	Multispectral TDI	X-Ray TDI	Board-level packaging	70% QE, FSI
Multispectral TDI	High-speed CMOS	CMOS linescan	Wafer-scale CCD	Wafer-scale CMOS