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PRESS RELEASE: Teledyne DALSA Announces MEMS Integrated Design for Inertial Sensors (MIDIS™) Platform

Posted 6/4/2013

WATERLOO, Ontario - June 4, 2013 – Teledyne DALSA Semiconductor, a Teledyne Technologies company and a world-leading pure-play MEMS foundry, today announced the availability of its new MIDIS 200 mm MEMS fabrication platform for motion sensing devices. The platform is designed to provide high volume, low cost manufacture of accelerometers and gyroscopes or the integration of both into an Inertial Measurement Unit (IMU), addressing the rapidly expanding demand for inertial sensors for consumer (mobile), automotive, and sports/health applications.

“Our MIDIS™ platform is a break-through technology that greatly reduces time to market by using a standardized process, rather than developing each new device from the ground-up, while making no compromises in performance,” said Donald Robert, VP of Marketing at Teledyne DALSA Semiconductor. “Our high performance Through Silicon Via (TSV) and wafer bonding approach provides high vacuum and hermeticity, without the need for expensive getters, in a very compact wafer level package.”

Key Features and Benefits

  • Low product cost achieved by reduced die size and elimination of getter
  • Standardized process reduces time to market, cost and development time
  • High vacuum and hermeticity allows resonator Q factors > 20,000
  • Efficient wafer level packaging minimizes overall die size
  • Comprehensive design rules maximize yield and reliability

Sensors fabricated using Teledyne DALSA’s MIDIS platform are already sampled or in production with alpha customers and the platform is now being made available to the general market. For more information, contact sales.semi@teledynedalsa.com. To learn more about the MIDIS platform, visit our website at www.teledynedalsa.com/midis.

Webcast: Introducing MIDIS Platform

Interested in learning more about the MIDIS platform? Register for our live webcast, which will take place on June 27, 2013. During the webcast, Luc Ouellet, VP of Technology Development at Teledyne DALSA Semiconductor and Laurent Robin, Technology & Market Analyst for Inertial MEMS Devices & Technology at Yole Développement will explain the finer points of this breakthrough new platform and the exciting possibilities it enables for consumer device designers.

About Teledyne DALSA Semiconductor
Located in Bromont, Quebec, Canada, Teledyne DALSA's award winning semiconductor wafer foundry has a proud history of innovation in specialties such as MEMS, CCDs, and high voltage CMOS. As a pure-play foundry, our goal is to deliver innovative foundry capabilities as a manufacturing partner to fabless and fab-lite semiconductor companies to help them succeed with their advanced MEMS or IC designs. For more information, visit www.teledynedalsa.com/semi.

About Teledyne DALSA, Inc.
Teledyne DALSA, a Teledyne Technologies company, is an international leader in high performance digital imaging and semiconductors with approximately 1,000 employees worldwide, headquartered in Waterloo, Ontario, Canada. Established in 1980, the company designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing MEMS products and services. For more information, visit www.teledynedalsa.com.  

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All trademarks are registered by their respective companies.
Teledyne DALSA reserves the right to make changes at any time without notice.

Media Contact:
Heather Neale
Teledyne DALSA
Tel: +1-514-333-1301 ext. 4227
Email: heather.neale@teledynedalsa.com

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