Imaging

Components & Systems

Cameras
High performance 1D/2D CMOS and CCD cameras.
3D Sensors
High accuracy laser profiling, stereo imaging, and Time-of-Flight sensors and cameras.
Frame Grabbers
Industry-leading image acquisition boards.
Image Sensors
Sensing all the wavelengths since 1980.
Software
From user friendly application software to industrial strength code libraries and SDKs.
Smart Cameras / Vision Sensors
Compact, self-contained vision tools with embedded software.
Vision Systems - Multicamera
Scalable multi-camera systems with embedded software.
Embedded Vision Systems
Scalable multi-camera systems with embedded software.
Medical & Dental X-Ray
Industry-leading low dose CMOS detectors and image processing software for medical and dental applications including fluoroscopy.
Industrial X-Ray
Powerful, innovative detectors and X-Ray generators for NDT and security applications.
Infrared Detectors
Versatile uncooled long-wave infrared sensors for industrial and defense applications.
Custom Design
Made-to-order solutions, from minor tweaks to major engineering.
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MEMS & Semiconductors

Specialized Semiconductor Services

MEMS Fabrication
One of the world's foremost pure-play MEMS foundries, supporting both 150 mm and 200 mm wafer processes.
CCD Fabrication
Industry-leading manufacturing capability for high-performance CCD fabrication processes.
Mixed Signal Circuit Design
High-performance, high-quality data-converter designs and IP blocks for the industrial, professional, scientific, imaging, and audio markets.
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R&D

MEMS Innovation

Teledyne DALSA has an active R&D program focused on leading technology for MEMS manufacturing.

A partner in the nearby state-of-the-art facility, C2MI, we help develop the next generation of demanding processes on 200mm to enable the new functionalities and increased capacity required by our customers

C2MI also works to develop new processes, prototyping and low-volume manufacturing, which can be scaled up to high volume with Teledyne DALSA.

C2MI

The Collaborative Centre for Microelectronics Innovation, or C2MI, is an R&D facility able to develop MEMS technology that can be readily transferred into high volume production. Thanks to a large investment by Canadian industry and government, this facility features some of the most advanced MEMS development capabilities in the world.

Teledyne DALSA is a founding member of the Collaborative Centre for Microelectronics Innovation. It is a new, purpose built R&D centre for advanced packaging and MEMS, focused on bridging the gap from leading edge research to high volume commercial production. Teledyne DALSA engineers develop new processing techniques using the Centre’s state of the art 200 mm, production worthy tools, allowing a smooth and rapid transfer to high volume at our nearby production fab.

The C2MI is operated independently of its industrial partners - you don’t have to be a customer of Teledyne DALSA to make use of its advanced MEMs R&D facilities. For details visit the C2MI website www.c2mi.ca.

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