From commercial off-the-shelf products to modified versions of existing products to full custom solutions, we have you covered. Our deep experience in the development, test and deployment of sensor technology powers some of the world’s most bespoke ISR systems. We’ll ensure a technology path that ensures both rugged operation now, and for many years into the future.
Teledyne provides smarter mission critical products to solve the most complex Intelligence Surveillance Reconnaissance (ISR) imaging challenges. We deliver innovative and advanced solutions to provide the very height of technological advantage to our customers. With our extensive experience in ruggedized, rad-hard space, ISR and proven industrial solutions, we offer a choice of imaging modalities and robust product building blocks. We are privileged to engage with the industry’s most technology-forward ISR companies. These companies, with turnover beyond $1 billion dollars a year, are leading the world with their innovative and progressive solutions. Working closely with our partners has allowed us to continually push the edge of our own technology, helping our partners toward their own successful solutions.
In addition to our leading-edge technologies,
We offer our customers specialized capabilities
And product enhancements:
Color and Monochrome Cameras
Resolution
0.5M up to 67M
Speed
Up to 850 fps depending upon camera
interface and specifications
KEY FEATURES
• Compact
• Can be ruggedized
• Semi-custom options: conformal coating, Piezo forward motion compensation
• Option for UART (RS-232). This is applicable for some cameras
• 1 GigE, 5 GigE, 10 GigE, CL and CXP interface
• Standard product
Resolution
1.7M up to 67M
Speed
Up to 162 fps depending upon camera and
specifications
KEY FEATURES
• Compact
• Can be ruggedized
• Semi-custom options: conformal coating, Board level available
• USB3 interface
• Lens controller
• Standard product
Resolution
86M up to 6 µm pixel size
Speed
2 fps
KEY FEATURES
• Piezo forward motion compensation
• NIR response
• In-camera image pre-processing (flat field, pixel correction)
• Ruggedized for Open Skies Program
• Lens options available
• Standard product
Resolution
17 µm VGA (640 x 480)
Speed
30 Hz
KEY FEATURES
• VOx
• Wafer level packaging
• 8 – 14 µm spectral range
• Small form factors
• NETD of <50 mK to <65 mK (depending upon model); F/1.0 at 30 fps
• Dynamic Range >600°C (with NETD above)
• GigE vision, CSI-2 interface options
• Standard product with possible customization
Resolution
12 µm QVGA (320 x 240) and VGA (640 x 480)
Speed
30/60 Hz
KEY FEATURES
• VOx
• Deep-ADC ROIC circuit
• 8 – 14 µm spectral range
• Small form factors: 21 mm x 21 mm x 12.9 mm core only
• NETD of <50 mK to <60 mK (depending upon model); F/1.0 at 30 fps
• Dynamic Range >600°C (with NETD above)
• Lens selection ranging from ~10 to 90-degree HFOV
• Standard product with possible customization
FOR MORE INFORMATION ON
OUR INFRARED PRODUCTS,
PLEASE VISIT US
Resolution
3,072 B1-B4 pixels, 28 µm pixel size
12,288 P1 & P2 pixels, 7 µm pixel size
SPEED
B: 10 kHz
P: 40 kHZ
KEY FEATURES
• 2 pan bands and 4 multispectral bands
• Customizable multispectral bands
• ~½ the power & ¼ the noise of typical CCD
• Integrated multispectral filters
• Selectable TDI stages
• Radiation tolerance:
• ≥20 krad (Si), Co60 (TID)
• No destructive latch-up (SEL) ≥75 MeV/mg/cm
Resolution
6, 144 B1-B4 pixels
12,288 P1 & P2 pixels
SPEED
B: 9.5 kHz
P: 38 kHz
KEY FEATURES
• 2 pan bands and 6 multispectral bands
• Customizable multispectral bands
• Super Resolution possible
• ~½ the power & ¼ the noise of typical CCD
• Integrated multispectral filters
• Selectable TDI stages
• Radiation tolerance:
• ≥20 krad (Si), Co60 (TID)
• No destructive latch-up (SEL) ≥75 MeV/mg/cm2
Resolution
9,050 B1-B4 pixels, 28 µm pixel size
36,300 P1 & P2 pixels, 7 µm pixel size
SPEED
B: 15 kHz
P: 30 kHz
KEY FEATURES
• 3 sensors butted together in a single ceramic package
• 2 pan bands and 4 multispectral bands
• Customizable multispectral bands
• ~½ the power & ¼ the noise of typical CCD
• Integrated multispectral filters
• Selectable TDI stages
• 45 µm planarity
• Radiation tolerance:
• ≥20 krad (Si), Co60 (TID)
• No destructive latch-up (SEL) ≥75 MeV/mg/cm
Resolution
3,072 B1-B4 pixels, 28 µm pixel size
12,288 P1 & P2 pixels, 7 µm pixel size
SPEED
B: 10 kHz
P: 40 kHz
KEY FEATURES
• 2 pan bands and 4 multispectral bands
• Ruggedized design for high shock and vibrations
• Camera mounting interface is customizable
• Area mode and TDI mode
• Stage selection per band
• Customizable multispectral bands
• Camera architecture can support other Teledyne DALSA multispectral sensors
• Radiation tolerance:
• ≥20 krad (Si), Co60 (TID)
• No destructive latch-up (SEL) ≥75 MeV/mg/cm
Resolution
1,024 pixels, 16 µm pixel size
Speed
40 kHz
KEY FEATURES
• Visible response: 400 nm to 900 nm, InGaAs response: 950 nm to 1700 nm
• HDR mode
• Cycling mode
• Programmable I/Os
• Compact form factor (46 mm x 46 mm x 55 mm)
• Configurable full well
• GigE 7 CameraLink interface
• Standard product
