Development of photolithography, metrology, inspection and plasma process technology blocks
for a 3D stacking microfabrication platform
Job description and project scope
To develop the following technology blocks that will support the 3D integration platform for ROIC/CMOS/MEMS /sensors wafers:
Description of the program
Teledyne DALSA (http://www.teledynedalsa.com/), located at Bromont (Quebec, Canada), is a world class foundry for MEMS, wafer level packages and sensors manufacturing by surface and bulk micromachining for major international customers in various highly technological markets, such as telecommunications, industrials, aerospace, biomedical or consumer electronics. Our customers use our technologies to produce advanced MEMS and sensors devices, which satisfy the needs for these very competitive markets. Teledyne DALSA is an ISO9001, QS9000, TS-16949 and ISO-14001 registered foundry.
Teledyne DALSA is currently launching a program to expand the portfolio of its 3D technologies as to offer turnkey solutions to its internal and external customers for ROIC/CMOS/MEMS/sensors vertical integration. To achieve this goal, three technology blocks have to be developed, mastered and controlled for high volume manufacturing using high Quality standards and procedures:
To help us supporting the photolithography, metrology, inspection and plasma processes, a position is open for a dynamic autonomous and experienced professional who will work in the LIMS at the MiQro Innovation Collaborative Centre (C2MI, http://www.c2mi.ca/fr/accueil/). This position is offered at our development and production factory in Bromont, Quebec.
This position requires the knowledge of the following manufacturing technologies:
This position requires the knowledge of the following manufacturing equipment:
REQUIREMENS AND SKILLS
The Teledyne group of companies offer competitive salary, excellent benefits package, excellent career opportunities and encourage global internal mobility. We pride ourselves in being an Equal Opportunity Employer.