Teledyne DALSA was founded by image sensor pioneer Dr. Savvas Chamberlain. For almost 30 years we have been a world leader in CCD image sensor design, amassing dozens of patents and introducing countless innovations and performance enhancements in both the design and fabrication of CCDs. With our own wafer foundry, we can control the entire process from design to delivery, offering both the ultimate in performance tuning but also security of supply. Our standard product list is extensive, but with our custom capabilities, almost anything is possible, from small devices capable of 100 million frames per second to wafer scale devices over 100 megapixels. And beyond the imagers themselves, we can also offer specialized peripheral chipsets to
optimize camera performance with the lowest costs and highest flexibility.
For the highest image quality possible, Teledyne DALSA's large pixel area devices deliver more than 12 true bits of dynamic range at room temperature. Our vertical antiblooming structures help keep fill factor and angular response high, even as they prevent overilluminated highlights from washing out neighboring pixels. Our area CCDs are available in a variety of configurations, including ultra-high resolutions or ultra-high high frame rates. These imagers excel in the highest performance applications from professional medium format photography to industrial inspection, and from fluoroscopy to aerial photogrammetry.
Standard and custom options include:
Teledyne DALSA's line scan CCDs are the main reason for the dominance of our line scan cameras in machine vision markets. Our imagers' combinations of speed, responsivity, and dynamic range has made us industry leaders for close to 20 years. High performance features such as pinned photodiodes, multiple output taps, trilinear color, and resolutions up to 17000 pixels help our custom design clients succeed in the most demanding applications. Innovations such as dual line scan demonstate our ongoing leadership.
Standard and custom options include:
Teledyne DALSA was a pioneer in TDI (time delay and integration) line scan technology and continues to be the acknowledged world leaer. The multiple exposures of TDI imaging can deliver orders of magnitude more sensitivity in low light than single line imagers. TDI is crucial to the highest performance inspection applications such as semiconductor wafer inspection, where systems must reduce inspection time while still catching 100% of defects on micron scales. Because they require so much less light, TDI imagers are useful wherever objects move at high speeds, such as in postal and parcel inspection systems, or where high intensity illumination would cause damage to the products (e.g. food inspection).
Standard and custom options include:
For more information email sales.sensors@teledynedalsa.com.