Image Sensor Solutions
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- Professional Photography
- Industrial Imaging
- Medical Imaging
- Aerospace Imaging
- Defense and Security Imaging
MultispectralProducts
Technology
Industrial Imaging Sensors
Industrial inspection is a vital part of modern manufacturing as producers seek to improve quality control and increase manufacturing yield. Whatever the product, the trend is toward more points of inspection, but the key is always to capture yield-limiting defects (and avoid false positives) while reducing the overall time for inspection. Teledyne DALSA sensors form the heart of a wide range of industrial applications, whether in our own cameras or our customers' proprietary systems.
Semiconductor wafer inspection
In semiconductor manufacturing, yield drives costs, so manufacturers inspect products at many points between bare wafers and packaged ICs, seeking to identify defects as soon as possible. As lithography geometries shrink, inspection systems need to be able to resolve defects on progressively deeper sub-micron scales (eg. 65 nm, 45 nm, 32 nm...). In the highest-performance situations, the features are so small that visible light cannot resolve them, and inspection systems must use deep ultraviolet (DUV) wavelengths for illumination. These are some of the most challenging inspection situations in the world, and Teledyne DALSA custom TDI line scan imagers dominate with incredible sensitivity and multitapped architectures for gigapixel throughput.
Electronics & printed circuit inspection
Electronics inspection applications typically involve Automated Optical Inspection (AOI) at multiple manufacturing stages, from bare printed circuit boards inspection to solder paste inspection to populated board inspection (post-reflow), and Automated X-ray Inspection (AXI). As in semiconductor inspection, our high speed, high responsivity line scan and TDI line scan imagers deliver better images in less time with less light.
Our high-speed area sensors also enable 2D and 3D inspection of BGA, CSP and flip-chip packages, both in visible light and X-ray designs; they are also frequently used in wire bonding.
Flat panel inspection
Manufacturing flat panel displays involves precise layering of materials including glass, semiconductors, metals, and polarizing films and subjecting them to many sophisticated etching and electrochemical processing steps. Teledyne DALSA’s high resolution and high speed linescan and TDI sensors find extensive use inspecting virtually every layer in flat panel manufacture. The high resolution and high speed of the devices in our own cameras allow inspection systems to boost throughput, while the excellent image quality delivers the highest level of discrimination between materials and mask layers. Manufacturers also use our high resolution area scan imagers for low contrast and nonuniform brightness (mura) and backlight inspection.
High speed machine vision
Our CMOS imagers, with true global shutters, are well suited to any industrial inspection application that needs to pick crisp detail from fast-moving targets. And for truly exotic high speed inspection applications (fuel injector research, ballistics, fluid dynamics), we offer custom devices with frame rates up to 100 million frames per second.
Traffic applications
With wide variations in lighting, bright reflections, and fast-moving targets, traffic imaging is a challenging application. But our CMOS devices are well suited to the task with high frame rates, high sensitivity, excellent antiblooming performance and wide dynamic range.
Postal and parcel sorting
Automation is vital to modern postal and parcel sorting. While 1D and 2D bar codes have simplified retail scanning, manufacturers of postal sorting equipment must deal with much more challenging conditions and targets. Some of the challenges are handwriting variations, paper variance, and variation in parcel height, which makes focus difficult. The high speed, large resolution line scan and TDI line scan imagers in Teledyne DALSA cameras enable superior throughput and image quality, without the need for expensive, high-power illumination.
Non-destructive testing
X-ray imaging offers manufacturers and industrial service providers a tool to investigate, in a non-destructive manner, objects and object properties that cannot be inspected optically. For example, with X-ray inspection systems, weld and solder joint quality can be easily and quickly inspected. Other examples are inspection of wire joint quality within semiconductor device packages, Ball Grid Array (BGA) inspection, multilayer PCB inspection as well as food inspection. X-ray inspection is also a useful tool for field failure analysis applications. Teledyne DALSA offers outstanding capabilities in X-ray imagers for large and small fields of view. We have extensive experience in fiber optics and scintillators and our demonstrated capabilities with large buttable CMOS imager tiles permit active areas of 30 x 24 cm and beyond.
For more information email sales.sensors@teledynedalsa.com.
Products
Custom backside thinned TDI line scan sensor with 2 Gpix/sec throughput for semiconductor wafer inspection. View our full product list.
