Semiconductor & MEMS Foundry
Wafer Fabrication Capability Overview
Teledyne DALSA's fabrication strengths include integration of sense and actuation circuitry alongside MEMS structures, flexible wafer-scale packaging, and a range of materials, equipment, and process flows that enable the most advanced MEMS and image sensor performance. We own dozens of patents in fabrication technology. Many of our process technologies are usually considered unconventional or even contradictory in mainstream integrated circuit production, but Teledyne DALSA Semiconductor's foundry services together provide designers and customers with a rare ability to optimize architecture, performance, and reliability to meet the needs of high-volume, mission-critical microsystems in photonics, telecom, biomedical, automotive, and industrial applications.
New Brochures
Process Overview Brochure
MEMS Brochure
Design Services
Take advantage of our years of experience and specialized tools--let Teledyne DALSA design a solution for you
Shuttle Runs
Teledyne DALSA provides regularly scheduled fabrications of multi-project wafers,
allowing designers to experiment with different designs on a portion of a wafer
in low volume without the cost of a full wafer run. Read more...
