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Delivering the Future with Integrated MEMS

Teledyne DALSA is renowned for its extensive experience with advanced fabrication strategies such as stacking circuits to reduce package size or combining MEMS and CMOS wafers to integrate sense and actuation with logic circuits. With years of experience in 3D and wafer level packaging technologies including through-silicon vias and a wide range of bonding techniques, Teledyne DALSA can help you transcend traditional design limitations.

From RF chips for cellphones and optical cross-connects for telecom to chemical and particulate sensors for smoke detectors, inertial motion sensors for game controllers, automotive pressure sensors, and microfluidic devices for miniaturized medical systems, integrated MEMS enable innovations that reduce both size and power consumption even as they increase performance.

TSVs

TSV Teledyne DALSA has offered high aspect ratio TSVs for years (Depth > 400 µm) with HV operation, thermal oxide isolation, options for Ni/Pd plating and deep cavities, and standard dicing without the need for a “pad expose” step. We are augmenting our existing via-first low-resistivity ISDP fill process (typical resistance < 1 Ohm for 430 µm depth, capacitance < 10 pF) with a higher performance copper fill process with even lower resistivity and higher thermal dissipation for faster operating frequencies and higher power density. This new copper fill process is well suited to volume production with high etch rate Bosch DRIE processes, which can reduce DRIE step costs by up to 50%.

WLP

Wafer Level Package Surface mountable 3D ICs use wafer level packaging for dramatic size and form factor reduction with corresponding cost reductions, making them ideal for mobile applications. Teledyne DALSA offers advanced I/O options including µBGA, solderable pads, or standard pads for stacked die and co-package designs, with hermetic seals for oscillators, pressure and image sensors, and non hermetic for RF filters, microfluidics and Si microphones.

Bio-MEMS

Teledyne DALSA is uniquely positioned with our integrated MEMS, HV CMOS and imaging technologies to develop and manufacture Bio-MEMS and integrated life science applications. Teledyne DALSA’s toolbox of micro-fluidic and HV-CMOS cells can be used to create revolutionary Lab-On-Chip technology platforms.

Our strength is in our ability to reach the high levels of integration needed in stand alone point-of-care products. Our advanced packaging options and proven high-volume manufacturing capability make us your ideal foundry partner for the bio-MEMS designs that will change the future.