Teledyne DALSA has over 10 years experience in manufacturing MEMs pressure sensors of both piezoresistive and capacitive types, for a wide variety of automotive and industrial applications. The key technologies of a piezoresistive sensor are ion implantation (of the Wheatstone bridge) , electrochemical etching (KOH or TMAH) of the cavity and direct wafer bonding for sealing the cavity.
In the MEMs context, Silicon microphones may be regarded as a specialized form of capacitive pressure sensor. A typical microphone process at Teledyne DALSA uses in-situ doped poly and low stress nitride in order to control stress in the membrane, and DRIE for cavity etching.
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