Teledyne DALSA has over 10 years experience in manufacturing MEMs pressure sensors of both piezoresistive and capacitive types, for a wide variety of automotive and industrial applications. The key technologies of a piezoresistive sensor are ion implantation (of the Wheatstone bridge) , electrochemical etching (KOH or TMAH) of the cavity and direct wafer bonding for sealing the cavity.
In the MEMs context, Silicon microphones may be regarded as a specialized form of capacitive pressure sensor. A typical microphone process at Teledyne DALSA uses in-situ doped poly and low stress nitride in order to control stress in the membrane, and DRIE for cavity etching.
Engine Manifold Pressure Sensor
MEMS Microphone
MEMS Pressure Sensors
MEMS Microphone
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