MEMs motion sensors have found widespread use in recent years in hand held devices and automobiles and this trend is set to accelerate and diversify as designers and manufacturers realize the potential of these devices.
Teledyne DALSA’s Generic Inertial Sensor Platform is a sub-set of our MEMs Toolbox configured for fabrication of accelerometers and gyroscopes, or the integration of both into an inertial measurement unit (IMU). Key process modules include DRIE, poly thru-silicon vias, and wafer bonding – including under vacuum for high Q gyroscopes. Precise control of our in-house grinding and CMP in many cases removes the need for expensive SOI wafers. The sensor platform is designed to facilitate its integration into a complete wafer level packaged solution, with the control ASIC forming part of the package and the external I/Os accessed by copper TSVs.