In addition to complete wafer fabrication processes, Teledyne DALSA offers to its customers specific single manufacturing step services as described below.

Wafer Grinding/Polishing

Scanning acoustic image of 200 mm wafer after backgrind

Wafer thinning has become an important step for MEMS technologies. Teledyne DALSA offers state-of-the-art tools for wafer thinning (grinding) and polishing.

• Backgrinding
• Edge grinding
• Polishing (CMP)

Bonding

Teledyne DALSA offers a wide variety of bonding technologies available for customers looking for a reliable foundry partner to rapidly expand their own internal capacity for such a critical MEMS processing step. Our bonding technology portfolio includes the following techniques:

• Si-Si, Si-SiO₂ and SiO₂-SiO₂ fusion bonding
• Eutectic bonding
• Polymer bonding
• Solder bonding
• Thermo-compression bonding
• Glass frit sealing
• Anodic bonding
• Plasma-assisted polymer bonding
• Temporary bonding

Plating

Teledyne DALSA offers the following technologies for wafer plating:

• Electroless plating of Ni/Au for under-bump metallisation (150 mm and 200 mm wafers)
• Electrolytic plating of Cu for interconnect/redistribution (200 mm wafers only)

 Brochures

Process Overview Brochure
MEMS Brochure

For more information on individual processes and special requests, please contact us.