In addition to complete wafer fabrication processes, Teledyne DALSA offers to its customers specific single manufacturing step services as described below.
Wafer thinning has become an important step for MEMS technologies. Teledyne DALSA offers state-of-the-art tools for wafer thinning (grinding) and polishing.
Teledyne DALSA offers a wide variety of bonding technologies available for customers looking for a reliable foundry partner to rapidly expand their own internal capacity for such a critical MEMS processing step. Our bonding technology portfolio includes the following techniques:
Teledyne DALSA offers the following technologies for wafer plating:
For more information on individual processes and special requests, please contact us.