Semiconductor » Fab

Foundry Capabilities

Teledyne DALSA's fabrication strengths include integration of sense and actuation circuitry alongside MEMS structures, flexible wafer-scale packaging, and a range of materials, equipment, and process flows that enable the most advanced MEMS and image sensor performance. We own dozens of patents in fabrication technology. Many of our process technologies are usually considered unconventional or even contradictory in mainstream integrated circuit production, but Teledyne DALSA Semiconductor's foundry services together provide designers and customers with a rare ability to optimize architecture, performance, and reliability to meet the needs of high-volume, mission-critical microsystems in photonics, telecom, biomedical, automotive, and industrial applications.

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