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PRESS RELEASE: Teledyne DALSA Semiconductor to Showcase Advances in MEMS/MOEMS Fabrication and High Voltage Electrostatic Actuator Integrated Circuits at OFC/NFOEC 2013

Posted 3/11/2013

WATERLOO, Ontario – March 11, 2013 – Teledyne DALSA Semiconductor will feature its latest advancements in MEMS/MOEMS fabrication along with its innovative High Voltage electrostatic actuator ICs at OFC/NFOEC 2013, the world’s leading event for advancing optical solutions. Hosted at the Anaheim Convention Center, in Anaheim, CA, USA, the exposition will run from March 19-21, 2013 and Teledyne DALSA will be located at booth 3704.

Teledyne DALSA’s Design and Foundry Showcase at OFC/NFOEC:

Leading Independent Pure-Play MEMS Foundry on 150mm & 200mm Wafers – Teledyne DALSA has extensive experience with advanced fabrication strategies and a profound understanding of the physics and materials science that make rapid new product introductions of MEMS and MOEMS possible. Teledyne DALSA MEMS/MOEMS proven process module portfolio on 150mm and 200mm wafers is recognized as exceptional and represents true competitive advantage for manufacturing of MEMS micro-mirrors and other optical MEMS applications.

High Voltage Electrostatic Actuator Design & Manufacturing – Teledyne DALSA also offers a full suite of product development and manufacturing solutions for low-power, high-channel count actuators for compact, high density systems. Teledyne DALSA announces the DH9685AB extending Teledyne DALSA’s industry leading MEMS and MOEMS capability and provides a cost-effective solution for high density systems. It has 96 High Precision, High Voltage Channels up to 240V in a 17x17 mm BGA Package, ROHS compliant. It operates through a versatile digital 3-wire interface.

Customer Interaction / Business Partnerships
– Teledyne DALSA’s technology portfolio, together with excellence in planning, quality assurance, and customer interaction deliver highly productive relationships with both customers and business partners.

Where:
OFC/NFOEC
Anaheim Convention Center
Anaheim, CA
Booth 3704

When: March 19-21, 2013

Media Note: For interview requests, please email heather.neale@teledynedalsa.com or visit Booth #3704. For high resolution images of Teledyne DALSA products, please visit our online media kit.

About Teledyne DALSA Semiconductor
Located in Bromont, Quebec, Canada, Teledyne DALSA's award winning semiconductor wafer foundry has a proud history of innovation in specialties such as MEMS, CCDs, and high voltage CMOS. As a pure-play foundry, our goal is to deliver innovative foundry capabilities as a manufacturing partner to fabless and fab-lite semiconductor companies to help them succeed with their advanced MEMS or High Voltage Electrostatic Actuator designs. Visit www.teledynedalsa.com/semi/ for more information.

About Teledyne DALSA, Inc.
Teledyne DALSA, a Teledyne Technologies company, is an international leader in high performance digital imaging and semiconductors with approximately 1,000 employees worldwide, headquartered in Waterloo, Ontario, Canada. Established in 1980, the company designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing MEMS products and services. For more information, visit Teledyne DALSA’s website at www.teledynedalsa.com.

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All trademarks are registered by their respective companies. Teledyne DALSA reserves the right to make changes at any time without notice.

Media Contact
Heather Neale
Teledyne DALSA
Tel: +1-514-333-1301 ext. 227
heather.neale@teledynedalsa.com

Sales Contact
Teledyne DALSA Semiconductor
Telephone: +1-450-534-2321 or 1-800-718-9701
Fax: +1-450-534-3201
Email: sales.semi@teledynedalsa.com

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