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PRESS RELEASE: Teledyne DALSA Semiconductor to Feature MEMS and HV ASIC Advances at MEMS China

Posted 6/4/2012

WATERLOO, Ontario - June 5, 2012 - Teledyne DALSA Semiconductor, a Teledyne Technologies company, will feature its latest advancements in design and fabrication, including its newest standard product integrated circuits, and its latest advancements in MEMS and HV ASIC design capabilities at MEMS China held June 11-13, 2012 at the Shanghai Everbright Convention and Exhibition Center. Teledyne DALSA will exhibit at booth 619.

On June 11 at 11:00 - 11:30 a.m. Teledyne DALSA will present, "Teledyne Dalsa - Leading Independent Pure Play MEMS Foundry," and demonstrate its design and manufacturing capabilities and comprehensive technology portfolio that provides foundry services to customers worldwide.

At MEMS China Teledyne DALSA will exhibit:

New Electrostatic Actuator High Voltage Integrated Circuits - Using proprietary High Voltage CMOS/DMOS technology, the DH9685AB, a 240V, 96-Channel, Precision High Voltage Programmable 16-bit DAC with Sample & Hold is designed for next-generation, high density, small footprint, low power systems using MEMS or MOEMS activation with electrostatic forces. This IC has a standard SPI®/3-wire serial interface for DAC programming up to 50MHz; its low voltage power supplies require only single polarity whilst its HV output remains very stable over time.

A second IC, the DH9665A, features a 96-channel, High Voltage Sample & Hold Linear Amplifier with a Precision of ±20mV over a wide Linear Output Range up to 240V.  

Leading Independent Pure-Play MEMS Foundry Capabilities on 150mm & 200mm wafers - Teledyne DALSA has extensive experience with advanced fabrication strategies and a profound understanding of the physics and materials science that make MEMS possible. At Photonix, Teledyne DALSA will feature MEMS Foundry Services with a sophisticated "toolbox" of proven and patented process modules and techniques, including DRIE, surface & bulk machining, TSV with ISDP or metal plugs, anhydrous HF Release, low stress SiN, thick polymers, and wafer bonding.

HV ASIC Design - Teledyne DALSA also offers industry-leading manufacturing capability and design support for high voltage CMOS ICs such as drivers for micro-mirrors, inkjet print heads, flat panel displays, LEDs and LCDs, and microfluidics. Teledyne DALSA's custom HV ASIC design service can build complete application-specific solutions from the ground up with none of the compromises of off-the-shelf components. Teledyne DALSA's custom MEMS and HV ASIC design service can supply components or complete solutions to bring MEMS applications to their maximum potential. Not only can these ASICs optimize the performance of the applications, they can dramatically reduce the size, footprint, power consumption, cost, and complexity of the design by integrating the functionality of an entire board or collection of chips into a single IC.

Media Note: For interview requests, please email heather.neale@teledynedalsa.com or visit booth 619. Teledyne DALSA management will be available for media interviews during the week of the show. For high resolution images of Teledyne DALSA products, please visit our online media kit.

About Teledyne DALSA, Inc.
Teledyne DALSA, a Teledyne Technologies company, is an international leader in high performance digital imaging and semiconductors with approximately 1,000 employees worldwide, headquartered in Waterloo, Ontario, Canada. Established in 1980, the company designs, develops, manufactures and markets digitalimaging products and solutions, in addition to providing MEMS products and services. For more information, please visit www.teledynedalsa.com.

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All trademarks are registered by their respective companies.
Teledyne DALSA reserves the right to make changes at any time without notice.

Media Contact:
Heather Neale
Teledyne DALSA
Tel: +1-514-333-1301 ext. 227
Email: heather.neale@teledynedalsa.com

Sales Contact:
sales.asia@teledynedalsa.com

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