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PRESS RELEASE: Teledyne DALSA to Demonstrate MEMS Fabrication Advances at Sensors Expo 2011

Posted 6/6/2011

Independent MEMS foundry to showcase MEMS fabrication and high voltage ASIC design capabilities

 

WATERLOO, Ontario – June 6, 2011 Teledyne DALSA  will feature its latest advancements in MEMS fabrication along with its innovative HV ASIC design capabilities at Sensors Expo in Rosemont, IL, June 6-8, 2011 in booth # 309.  Sensors Expo 2011 is the leading forum on sensing technologies and solutions in North America.

 

Teledyne DALSA’s Design and Foundry Showcase at Sensors Expo:

 

Leading Independent Pure-Play MEMS Foundry on 150mm & 200mm wafers Teledyne DALSA has extensive experience with advanced fabrication strategies and a profound understanding of the physics and materials science that make MEMS possible. Teledyne DALSA’s MEMS process module portfolio on 150mm and 200mm wafers is recognized as exceptional and represents true competitive advantage for manufacturing of MEMS micro-mirrors and other optical MEMS applications.

 

HV ASIC Design – Teledyne DALSA also offers industry-leading manufacturing capability and design support for high voltage CMOS ICs such as drivers for micro-mirrors, inkjet print heads, flat panel displays, LEDs and LCDs, and microfluidics. In fact, Teledyne DALSA’s custom HV ASIC design service can build complete application-specific solutions from the ground up with none of the compromises of off-the-shelf components.

 

Customer Interaction / Business Partnerships Teledyne DALSA’s technology portfolio, together with excellence in planning, quality assurance, and customer interaction, deliver highly productive relationships with both customers and business partners.

 

 

Where: Sensors Expo & Conference

Donald E. Stephens Convention Center
Rosemont, IL
Booth 309

When:    June 6-8, 2011

 

Media Note: For interview requests, please email maria@redjavelin.com or visit booth #309. For high resolution images of Teledyne DALSA’s products, please visit our online media kit.

 

About Teledyne DALSA Semiconductor
Located in Bromont, Quebec, Canada,  Teledyne DALSA's award winning semiconductor wafer foundry has a proud history of innovation in specialties such as MEMS, CCDs, and high voltage CMOS. As a pure-play foundry, our goal is to deliver innovative foundry capabilities as a manufacturing partner to fabless and fab-lite semiconductor companies to help them succeed with their advanced MEMS or IC designs. Visit www.teledynedalsa.com /semifor more information.

 

About Teledyne DALSA, Inc.
Teledyne DALSA, a Teledyne Technologies company, is an international leader in high performance digital imaging and semiconductors with approximately 1,000 employees worldwide, headquartered in Waterloo, Ontario, Canada. Established in 1980, the company designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing MEMS products and services. For more information, visit Teledyne DALSA’s website at www.teledynedalsa.com.

 

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All trademarks are registered by their respective companies. DALSA reserves the right to make changes at anytime without notice.

 

Media Contact:

Maria Doyle

Red Javelin Communications, Inc.

Tel: +1-781-964-3536

maria@redjavelin.com

 

Sales Contact:

Donald Robert
VP Sales Foundry Business

Teledyne DALSA
Tel: (450) 534-2321 X 1445
donald.robert@teledynedalsa.com

 

 

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